FR2 Specification of Copper Clad Laminates, Printed Circuit Board, PCB, Electronic

Importer and Exporter of Paper Based and Epoxy Based
Copper Clad Laminates used for Printed Circuit Boards.

Products

COPPER CLAD LAMINATE
FR2 SPECIFICATION

NO	ITEM		UNIT	CONDITION AND METHOD	TYPICAL VALUE
1	SOLDER RESISTANCE(260⁰C)		SEC	A	20-35
2	HEAT RESISTANCE		-------	150⁰C30MIN	NO CHANGE
3	PEEL STRENGTH (35 Mm)		KGF/CM	A 280⁰C10SEC	1.8-2.0
4	FLEXURAL STRENGTH	LENGTHWISE	KGF/MM²	A	14-16
4	FLEXURAL STRENGTH	CROSSWISE	KGF/MM²	A	13-14
5	VOLUME RESISTIVITY		W CM	C-96/20/65	1X10^13~14
6	SURFACE RESISTANCE	ADHESIVE SIDE	W	C-96/20/65	1X10^11~12
6	SURFACE RESISTANCE	LAMINATE SIDE	W	C-96/20/65	1X10^10~11
7	INSULATION RESISTANCE		W	C-96/20/65	1X10^11~12
8	CHEMICAL RESISTANCE		------	3%NaOH 40⁰C 3 min	NO CHANGE
8	CHEMICAL RESISTANCE		------	Boiled in trichloroethylene for 3 min	NO CHANGE
9	WATER ADSORPTION		%	E-24/50+D-24/23	0.7^~0.9
10	FLAMMABILITY		SEC	A UL94	AVG 3.0 MAX 8.0
11	DIELECTRIC CONSTANT (1MHZ)		-----	C-96/20/65	4.0-5.0
12	DISSIPATION FACTOR		------	C-96/20/65	0.025^~0.035
13	CTI		V/	0.1%NH₄CI UL746A	>600V
14	PUNCHING TEMPERATURE		⁰C	A	AMBIENT70